High-end HDI and high-multilayer PCB quality determines end-device reliability, requiring a full-process, high-precision, strict-standard control system covering incoming material inspection, process monitoring, and final testing to meet IPC and customer requirements.
Incoming material inspection: Substrates, copper foil, dry film, and plating chemicals are sampled for Tg, dielectric constant, thermal expansion, copper thickness, and surface roughness to mitigate risks.
Process monitoring: Laser drilling (±5μm aperture, ±15μm alignment), lamination (±25μm alignment, ≤0.5% warpage), and plating (±10% copper uniformity, blind via fill quality) are monitored in real time.
Final testing: AOI (short/open circuits), X-ray (layer alignment/via fill), impedance testing (±10% tolerance), thermal shock (-55°C~125°C), and insulation resistance tests verify electrical/physical performance and reliability, ensuring zero defects.
