High-end HDI and high-multilayer PCBs are the 'neural centers' of smart devices, enabling miniaturization, high performance, and low power via dense routing and high-speed transmission, penetrating AI, 5G, autonomous driving, and medical electronics.
In AI servers, 20-30 layer ultra-high HDI boards provide high-speed GPU/CPU links, with backdrilling eliminating signal stubs for stable 10Gbps+ transmission, critical for AI model training. High-multilayer PCBs manage power and heat, reducing voltage loss and EMI for stability.
In autonomous driving, HDI miniaturizes core components: ADAS integrates cameras/LiDAR/radar for real-time data; in-vehicle infotainment uses multilayer HDI for displays, connectivity, and harsh environment resistance. In medical electronics, HDI enables high-resolution imaging (CT/MRI) and wearables for accurate diagnosis and portability.
