The global high-end HDI and high-multilayer PCB market is experiencing rapid growth, fueled by AI computing infrastructure and autonomous driving. The global HDI market exceeded $11 billion in 2024, projected to reach $16.8 billion by 2031, with high-end HDI (20+ layers) growing fastest. AI server HDI value per device is 170% higher than traditional solutions.
AI servers are the largest growth driver: next-gen servers adopt 20-30 layer ultra-high HDI boards instead of traditional multilayers, supporting 10Gbps+ GPU/CPU signal transmission. High-multilayer PCBs power backplanes and high-speed interconnects, reducing noise via multiple power/ground layers.
Autonomous driving demand is strong: ADAS, in-vehicle infotainment, and LiDAR rely on HDI for miniaturization and integration. A high-end autonomous car uses 3-5x more PCBs than a fuel vehicle. 5G, medical electronics, and aerospace further drive demand, creating opportunities for domestic PCB enterprises to expand globally.
